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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

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WILMINGTON, DE, July 7, 2005

Major Resin Expansion to Serve Growth of DuPont™ Vespel® Polyimide Parts

Vespel® parts and shapes

Contact: John Pringle
DuPont Engineering Polymers
416-720-8777
John.G.Pringle@can.dupont.com

Keeping pace with rising demand for DuPont™ Vespel® parts and shapes, the company’s Vespel® business unit is expanding its polyimide resin production facility in Circleville, Ohio. The expansion will provide material required for production of direct-formed Vespel® SP-1 and SP-21 polyimide parts. This additional facility will provide a 50 percent increase in capacity upon its projected startup in October.

Vespel® parts deliver outstanding performance in high-temperature, low-wear and low-friction components such as bushings, seal rings or thrust washers for automotive, aerospace, semiconductor manufacture and various other end-use industries, according to Mark Schmeckpeper, global product manager for Vespel®.

"This expansion underscores our commitment to increasing our production capabilities for Vespel® ahead of our customers’ anticipated needs," Schmeckpeper said. "We will continue to make proactive investments for additional capacity to make parts, shapes or other product lines ahead of increasing demand."

For more information about DuPont™ Vespel® parts and shapes, please visit www.dupont.com/vespel on the Web or call 1-800-355-4875.

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