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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials


SAN FRANCISO, CA, July 12, 2005

DuPont™ Vespel® Grade Helps Get Rid of Static Charges

Contact: John Pringle
DuPont Engineering Polymers

DuPont™ Vespel® SP-202 polyimide parts and shapes have what it takes to combat static charge buildup in the fabrication and handling of flat panel glass, semiconductor wafers and other products handled in high-temperature, vacuum or reactive environments. The new DuPont™ Vespel® composition is making its debut at Semicon West in San Francisco, July 12-14, 2005.

Parts such as holders, guides or pads made of DuPont™ Vespel® SP-202 polyimide combine consistent levels of electrical conductivity with an unmatched combination of thermal resistance, wear resistance, moisture resistance, toughness, strength and ease of machinability.  DuPont™ Vespel® SP-202 parts demonstrate surface resistivity below 10E3 ohm/square. Results of further tests to establish typical characteristics for electrical, mechanical and thermal properties will be available in the near future.

For more information about DuPont™ Vespel® SP-202 polyimide and any other Vespel® parts and shapes, please visit on the web or call 1-800-355-4875.

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