Semiconductor Fabrication Materials

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Shanghai, China, February 2, 2010

DuPont Semiconductor Materials Featured at Semicon China

DuPont exhibited its full portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2010.

Product offerings, included:

AlCu/Via process applications, WLP bumping and Cu interconnect solutions from DuPont EKC Technology
Customized solutions for your CMP and wafer polish needs from DuPont AirProducts NanoMaterials
Integrated materials for TSV creation, and TSV/3D from DuPont Wafer Level Packaging Solutions
Performance lubricants and coating solutions
Agressive fluid and low permeation products from DuPont™ Teflon®

Contact us for more information on DuPont Semiconductor Fabrication Materials

View Exhibit Panels from Semicon China 2010

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