June 24, 2010 Wafer Level Packaging (WLP) Solutions Exhibits at ECTC DuPont Wafer Level Packaging Solutions recently exhibited its broad and growing portfolio of materials for both current and emerging WLP requirements in the semiconductor industry, including three dimensional and through silicon vias (3D/TSV), bonding, fan out, bumping, pillars and redistribution dielectrics. » More
February 2, 2010 DuPont Presents at IMAPS Device Packaging DuPont will present two technical papers in addition to highlighting its material offerings for Wafer Level Packaging at the sixth annual IMAPS Device Packaging Workshop, March 9 - 11, 2010 at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona. » More
January 29, 2010 HD Microsystems Sponsors Symposium on Polymers The Symposium has become one of the most comprehensive meetings held on the implementation and the processing of polyimides and new polymeric materials in advanced semiconductor, electronic packaging and assembly applications. » More
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