May 6, 2009 DuPont Introduces Vespel® SCP Shapes The new SCP polymer family from DuPont™ Vespel® is now available in shapes. The Vespel® SCP family of products delivers improved part life, reduced weight and cuts costs. These benefits are delivered though increased temperature handling, improved dimensional stability, broader chemical compatibility and greatly improved wear resistance. » More
October 30, 2006 DuPont Breaks Ground for New Vespel® Plant in Singapore The new facility is the investment in a high-growth business - DuPont™ Vespel® parts and shapes. Industry demand for metals-replacement technologies that reduce weight and cost is driving a step-change for our business. » More
June 15, 2006 DuPont Showcases Semiconductor Fabrication & Packaging Materials at SEMICON West 2006 DuPont today announced it will showcase its expanding portfolio of semiconductor fabrication and advanced packaging materials at SEMICON West 2006 at the Moscone Center in San Francisco, Calif., July 11 - 13. By connecting science and technology from across the company, DuPont has established a leading position in the industry with highly engineered materials and advanced process expertise. » More
|
|
|