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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

News & Events

March 1, 2012
Air Products Agrees to Acquire DuPont’s Stake in DuPont Air Products NanoMaterials LLC JV Air Products (NYSE:APD) has entered into a definitive agreement to acquire all of DuPont’s interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), the two companies’ 50-50 joint venture serving the global semiconductor and wafer polishing industries. » More

September 8, 2010
DuPont Exhibits at Semicon Taiwan DuPont exhibited its broad and growing portfolio of semiconductor fabrication and packaging materials at Semicon Taiwan. » More

June 24, 2010
Wafer Level Packaging (WLP) Solutions Exhibits at ECTC DuPont Wafer Level Packaging Solutions recently exhibited its broad and growing portfolio of materials for both current and emerging WLP requirements in the semiconductor industry, including three dimensional and through silicon vias (3D/TSV), bonding, fan out, bumping, pillars and redistribution dielectrics. » More

June 8, 2010
DuPont EKC Technology & SVTC Collaborate on MEMs Integration for Cavendish Kinetics MEMS is a fast growing area with unique requirements, where advanced wet processing cleaning solutions are critical. The integration of technologies and formulations demonstrated to Cavendish Kinetics are now being implemented in scale-up activities underway at SVTC’s San Jose, Calif. facility.  » More

February 2, 2010
DuPont Presents at IMAPS Device Packaging DuPont will present two technical papers in addition to highlighting its material offerings for Wafer Level Packaging at the sixth annual IMAPS Device Packaging Workshop, March 9 - 11, 2010 at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona.  » More

February 2, 2010
DuPont Semiconductor Materials Featured at Semicon China DuPont will exhibit its full portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2010 at the Shanghai New International Expo Center, March 16 - 18   » More

January 29, 2010
HD Microsystems Sponsors Symposium on Polymers The Symposium has become one of the most comprehensive meetings held on the implementation and the processing of polyimides and new polymeric materials in advanced semiconductor, electronic packaging and assembly applications. » More