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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

Semicon Taiwan 2010

DuPont exhibited its broad and growing portfolio of semiconductor fabrication and packaging materials at Semicon Taiwan, at the Taipei World Trade Center, on September 8 - 10, 2010.

Offerings from the following businesses were featured:

  • DuPont EKC Technology Is the leading manufacturer of specialty chemicals used in the removal of photoresist and post-dry etch process residue enabling higher productivity, finer lines and improved yields.
  • DA NanoMaterials Offers a complete portfolio of vertically integrated solutions to meet your CMP and wafer polishing needs.
  • HD Microsystems Is the premier supplier of polyimide and PBO precursor chemistries specifically engineered for microelectronic applications.
  • Wafer Level Packaging Solutions Offers proven solutions for three dimensional and through silicon vias (3D/TSV), bonding, fan out, bumping, pillars and redistribution dielectrics.
  • DuPont™ Vespel® parts and shapes Vespel® parts offer you design flexibility and as with metals and ceramics, can successfully perform in demanding physical environments.
  • Kalrez® perfluoroelastomer parts With Kalrez®, manufacturers gain seal integrity and process purity that is backed by more than a quarter century of success.
  • DuPont™ Teflon® fluoropolymer resins and coatings Industrial products made with Teflon® fluoropolymer resins have exceptional resistance to high temperatures, chemical reaction, corrosion, and stress-cracking.
  • DuPont™ Zyron® electronic gases Provides high purity fluorine containing gases to meet the evolving needs of the semiconductor processing industry.

DuPont Semiconductor Fabrication Materials at SEMICON Taiwan