DuPont exhibited its broad and growing portfolio of semiconductor fabrication and packaging materials at Semicon Taiwan, at the Taipei World Trade Center, on September 8 - 10, 2010.
Offerings from the following businesses were featured:
DuPont EKC Technology
Is the leading manufacturer of specialty chemicals used in the removal of photoresist and post-dry etch process residue
enabling higher productivity, finer lines and improved yields.
Offers a complete portfolio of vertically integrated solutions to meet your CMP and wafer polishing
Is the premier supplier of polyimide and PBO precursor chemistries
specifically engineered for microelectronic applications.
Wafer Level Packaging Solutions
Offers proven solutions for three dimensional and through silicon vias (3D/TSV), bonding, fan out, bumping, pillars and redistribution dielectrics
DuPont™ Vespel® parts and shapes Vespel® parts
offer you design flexibility and as with metals and ceramics, can successfully perform in demanding physical environments.