Polishing Slurries Chemical Mechanical Planarization (CMP) is used with different materials at different levels within the chip. The main layers being planarized with CMP slurries are Cu, Cu barrier (Ta/TaN), W, ILD, STI, Polysilicon and PMD layers.
MicroPlanar® slurries
Product line serves W, STI, Polysilicon and PMD CMP applications.
CopperReady® slurries Product line serves Cu and Cu Barrier CMP applications.
Syton® colloidal silica slurry Formulated for silicon dioxide films used in integrated circuits.
Post CMP Cleaners Post CMP cleaning is a yield enhancing process step that removes defects deposited during the planarization process.
PCMP5000™ series products PCMP5000™ series products are excellent PCMP cleaning solutions for use following Tungsten, Copper and STI CMP. These aqueous cleaning solutions offer outstanding results, including removal of residual metals and particles.
PCMP5510™ cleaning solution PCMP5510™ is an excellent PCMP cleaning solution for use following copper CMP.
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