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Semiconductor Fabrication Materials

The semiconductor industry is heavily reliant on etch and clean processes. DuPont semiconductor fabrication materials include wet clean and surface preparation solvents and removers, post clean surface treatments, dry chamber cleaning gases, and plasma etch solutions for etch and clean processes.

 

Wet Clean & Surface Preparation


Edge Bead Removers

  • EKC EBR-14 Proprietary mixtures of high purity organic solvents formulated for the removal of polyimide edge bead.

 

Photoresist Removers Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces used in the microelectronics industry.

Posistrip® Positive Photoresist Removers The EKC800™ series of products remove positive photoresist from a variety of substrates.

NRS Negative Photoresist Materials The EKC NRS series of products are designed to remove negative resist from sensitive metals.

Universal Photoresist Removers The EKC900™ series of products are formulated for use at elevated temperature for hard-to-remove positive or negative photoresist layers.

 

Post Etch Residue Removers Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes used in the microelectronics industry.

PlasmaSolve® HDA® Technology The EKC200™ and EKC 300™ series have been widely adopted as the industry standard for post etch residue removal on traditional integration materials. This technology provides robust cleaning solutions and wide process latitude for deep submicron devices.
SAC™ (semi-aqueous chemistry) Remover The EKC600™ series removes post etch residues quickly and effectively from traditional integration solutions.
CuSolve™ Copper Integration Technology The EKC500™ series post etch residue products are formulated for rapid and complete removal of residues formed during copper damascene integration processes.

 

Post Clean Treatments Post clean treatments specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step. Our surface treatment products are non-flammable, non-combustible, and contain no SARA Title III components.

EKC4000™ PCT A cost effective replacement that outperforms conventional "RINSE" chemistries such as IPA and NMP.

 

Dry Chamber Clean Cleaning is an important process to ensure the yield. DuPont provides chemicals for dry chamber cleaning.

DuPont™ Zyron® electronic gases DuPont supplies high-purity, fluorine-containing gases to meet the evolving needs of the semiconductor processing industry as it develops new generations of thin-film plasma processes.

 

Plasma Etch
DuPont™ Zyron® electronic gases We offer a variety of dry etch solutions used in the etch & clean process.