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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

ITRS Emerging Technologies - Interconnect

Novel Copper Electrochemical Planarization

CMP is an enabling technology for copper metallization, but presents a number of concerns such as mechanical downforce on fragile dielectrics, damage by abrasive particles, and slurry management and disposal. We are developing a unique electrochemical approach to address these limitations of the conventional planarization technology.

"Membrane-Mediated Electropolishing: A New Method to Planarize Copper," presentation at the May, 2006 ECS National Meeting.
Download: Abstract [.pdf], Presentation [.pdf]

"Membrane-Mediated Electropolishing, A New Method to Planarize Cu Damascene Interconnects" presentation at the October, 2005 meeting of the NCC AVS CMP Users Group.
Download: Presentation [.pdf]

"Membrane-Mediated Electropolishing of Damascene Copper," presentation at IITC 2005, June, 2005.
Download: Presentation [.pdf]

New ALD Metallization Precursors

The PVD methods used for copper-interconnect barrier and seed metal layers are expected to be replaced by more conformal and uniform ALD processes. We are developing new precursors specifically designed for optimum performance in such processes.

"Surface Activation: True ALD of Copper Films?", presentation at the ACS National Meeting, August, 2007
Download: Paper [.pdf]

"Advances in Surface Activation for Metal ALD," presented at ALD 2006, July 2006.
Download: Presentation [.pdf]

"Surface Activation: True ALD of Copper Films," presentation at ALD 2005, August 2005.
Download: Presentation [.pdf]

"Atomic Layer Deposition of Copper Metal for Advanced Interconnect Materials," presentation at the ACS National Meeting, August, 2004.
Download: Presentation [.pdf]

"Atomic Layer Deposition of Copper Metal for Advanced Interconnects," presentation at ALD 2004, August 2004.
Download: Presentation [.pdf]

"Design and Synthesis of Precursors for ALD of Copper Metal," presentation at ALD 2004, August 2004.
Download: Presentation [.pdf]