Optimal conformability, toughness and inertness to bonding adhesives
DuPont™ Tedlar® release films provide outstanding release from phenolic and epoxy resins as well as copper and caul plate surfaces, both hot and cold. Tedlar® films are also able to provide a quality release because they offer optimal conformability, toughness and inertness to bonding adhesives.
Additionally, some Tedlar® release films are designed to contain resin overflow during autoclave curing of motor windings and coils. They can also effectively minimize plate scumming while withstanding epoxy and phenolic press cycles and temperatures without embrittling or charring.
Because of its ease of release from epoxy-glass systems, high tensile strength and tear resistance, Tedlar® imparts a matte finish to the cured resin surface.
Tedlar® release films for electrical applications come in a variety of film types and thicknesses to be used for different applications. All Tedlar® films can be obtained with one side treated to accept adhesives or other bonding materials for the fabrication of specialty release laminates.
Typical applications include:
- Printed circuit boards
- Molded parts
- Electrical equipment
- Rubber industry