The miracles of science™

Select Industry


News

Dusseldorf, October 25, 2001

DuPont™ Vespel® Parts and Shapes for the semiconductor industry

DuPont™ Vespel® Parts and Shapes announces the introduction of TP-8005, a new family of finished parts and shapes made of translucent, unfilled thermoplastic polyimide. Their high purity and resistance to plasma and heat makes TP-8005 well suited for uses within the semiconductor industry. The material is weldable and wear resistant and maintains its good dielectric properties even at permanent operating temperatures of up to 200 °C.

As it is thermo-formable, TP-8005 offers finished parts and shapes with geometric flexibility and the opportunity to creatively improve the function and cost of mechanical design. The high elasticity of the material — tensile elongation at break of 79 per cent — makes the parts easy to install, even in the tightest of locations. When applied, Vespel® TP-8005 can provide semiconductor equipment parts that are exceptionally pure and withstand deformation from acid bath used to rinse the semiconductor. It is therefore an advantageous alternative to less durable metal and ceramic components commonly used in such aggressive environments.

Examples of the Vespel® TP Family are:

  • Vespel® TP-8005 - offers translucent polyimide parts designed specifically for semiconductor and high-purity applications.
  • Vespel® TP-2875 - ideal for petrol and diesel fuel-pump parts, thrust washers, and other applications in lubricated environments.
  • Vespel® TP-2346 - offers great wear resistance and is used in transmission shift pads, ATV thrust washers, and clutch buttons.
  • Vespel® TP-1012BK - provides high-modulus parts with superior wear resistance in dry environments.

Used widely in the automotive, aerospace and semiconductor industries, DuPont Vespel® parts and shapes consists of five families of materials that provide a unique combination of the physical properties of plastics, metals and ceramics, while offering maximum design flexibility. Starting as the Vespel® S line, the family has expanded significantly to include the introduction of Vespel® TP, a new thermoplastic material developed by DuPont, and the addition of three other material families:

  • Vespel® CP (composites)
  • Vespel® CR (chemical resistant)
  • Vespel® ASB (assemblies)

DuPont is a science company, delivering science-based solutions that make a difference in people’s lives in food and nutrition; healthcare; apparel; home and construction; electronics; and transportation. Founded in 1802, the company operates in 70 countries and has over 90,000 employees.


Plasma etch chamber components for the manufacture of semiconductors are one of the applications for new DuPont Vespel® TP-8005 parts and shapes. Their high plasma resistance extends the life of a chamber liner at least ten times longer than that of liners with an anodised coating and five times longer than liners of polymeric film. They help increase chip output because, as well as being exceptionally pure, their low erosion prevents the deposition of chemical substances, which in turn can lead to contamination. Outgassing is lower than with components made of non-aromatic polyimides, and they demonstrate better resistance to radicals and ions.

With their constant dielectric properties, the components are well suited to permanent operating temperatures of up to 200 °C. They offer flexibility for easy installation, eliminating labour-intensive bonding processes. The seamless construction eliminates residual chemical deposits, which can lead to deterioration at the weld line and more deposition on the wafer.