Wilmington, DE, October 25, 2001
The DuPont™ Vespel® Parts and Shapes expanded line includes five families
The DuPont™ Vespel® Parts and Shapes expanded line includes five families:
- Vespel® S (standard line): enhances balance and versatility and available in five resins, including SP
- Vespel® CP (composites): combines fibres with polymer to allow high performance flexibility and customisation, particularly within the aerospace industry
- Vespel® CR (chemical resistant parts): performs well in a variety of chemical environments
- Vespel® ASB (assemblies): simplifies product assembly and allows other parts to be eliminated
- Vespel® TP (thermal plastics): offers elevated temperature properties and enhanced chemical and impact resistance in injection-moulded forms
Several properties enhance performance when designing with DuPont™ Vespel®:
- Compositions can be loaded to high strains (>30%) without reaching ultimate strength and deformation levels
- Can carry loads at temperatures beyond the reach of most plastic material, while exhibiting extremely low creep
- Completely resistant to fungus attack, have outstanding resistance to high energy ionizing radiation, and are not toxic
End-use parts take the form of seal rings, bushings, washers, discs, wafer guides, insulators and many other parts that require resistance to high temperatures, extreme wear and corrosion.
Vespel® parts include a family of high performance polyimides that provides a unique combination of the physical properties of:
Targeted to project, process and design engineers, DuPont™ Vespel® Parts and Shapes offer unparalleled design flexibility.
Compressed into high performance parts and shapes, Vespel® parts are used extensively in the automotive, aerospace and semiconductor industries.
For example, when applied, Vespel® parts can provide:
- Automotive parts that withstand wear beyond warranty
- Aircraft engines with components that withstand high heat, long wear and low friction
- Semiconductor equipment parts that are exceptionally pure and withstand deformation from acid bath used to rinse the semiconductor