The introduction of DuPont™ Kalrez® 9300 and 9500 perfluoroelastomer parts for sealing remote and in situ plasma etch processes, and for demanding deposition processes where ozone is prominent, are two of the highlights of the DuPont multi-product and technology offerings to semiconductor wafer processors at Semicon Europa 2011. These new sealing materials will be featured during “Innovation and global collaboration in semiconductor processing”, a special DuPont event with presentations and poster sessions from 10:30-17:00 on Wed., 12 October, in Meeting Room 1.8 at Semicon Europa expo, where DuPont research scientists and DuPont electronics experts will discuss industry trends influencing sealing materials selection for plasma CVD and etch processes.
Kalrez® 9300 resists aggressive oxygen and fluorine-based plasma
DuPont has developed Kalrez® 9300 perfluoroelastomer parts for chip manufacturers who utilize oxygen (O2) and fluorine-based (CF4) plasma for wafer etch, to overcome the unacceptable erosion of seals exposed to aggressive processing or cleaning chemistry. Unlike many elastomers that typically erode and cause unwanted particles in such ion-rich environments, Kalrez® 9300 perfluoroelastomer parts offer exceptional sealing performance in a variety of challenging etch conditions (Figure 1). The DuPont perfluoroelastomer part allows chip manufacturers to use one product to solve a variety of sealing issues where previously several were required.
Exceptional resistance to ozone with Kalrez® 9500
Kalrez® 9500 has been developed specifically to resist the aggressive process chemistry used by chip manufacturers in SACVD and ash/strip processes, by demonstrating ultra-low weight loss in remotely generated plasma, and excellent resistance to ozone, ammonia and water vapour. A product of DuPont proprietary technology, Kalrez® 9500 has better resistance to oxygen and fluorine radicals that can erode traditional seal materials, excellent heat resistance with very low outgassing, and has a maximum continuous service temperature rating of 310°C.
More in IC fabrication technologies and products from DuPont
During its event at Semicon Europe 2011, DuPont IC experts will also discuss other recent innovations in IC fabrication technologies and products, including DuPont™ Vespel® parts and shapes, DuPont™ Teflon® fluoropolymers and DuPont™ Krytox® perfluorinated oils and greases, as well as DuPont EKC removers, cleaners and strippers that will also be featured on the DuPont EKC Technology booth 1.707.
Figure 1: Kalrez® 9300 demonstrates lower weight loss than other perfluoroelastomer (FFKM) parts.
DuPont™ Kalrez® 9300 parts are based on a proprietary crosslinking and mechanical reinforcement system developed from DuPont.
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October 12, 2011