Application Description
Vespel® TP-8005 is a line of transparent polyimide parts designed specifically for semiconductor and high purity applications.
Benefits Gained
Plasma etch chamber components made with Vespel® TP-8005 provide a seamless construction which eliminates residual chemical deposits. Those deposits would otherwise lead to deterioration at the weld line and more deposition on the wafer. This seamless construction provides etch resistance that extends the life of the chamber liner.
Vespel® TP-8005 also offers flexibility for easy installation, eliminating labor intensive bonding processes and exposure to bonding chemicals. And chamber liners made with Vespel® TP-8005 are custom-sized to provide solutions for equipment manufacturer requirements
Materials Selected and Why
In the semiconductor industry, longevity is crucial. Vespel® TP-8005 plasma components are specifically designed for endurance. In many cases, they extend the life of chamber liners longer than liners that have anodized coatings and longer than polymeric film liners. But Vespel® TP-8005 offers more than sheer durability. This unfilled thermoplastic polyimde offers low outgassing, a high level of cleanliness compared to non-aromatic polyimide components and is designed to perform well in a wide range of temperatures and conditions. It resists high temperatures with constant dielectric properties up to 392°F (200°C). Vespel® TP-8005 improves semiconductor chip production by reducing aluminum or ceramic from water contamination caused by particle deposition that can occur from erosion of anodized aluminum or shedding from liner seams made from anodized aluminum and ceramics.
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