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DuPont™ Vespel® S parts & shapes

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Product Data Sheets

Technical Literature

  • Vespel® S Product & Properties Guide  (1.0MB)
    Typical properties for the Vespel® S family including mechanical, electrical and thermal. Includes chemical effects data.

  • Vespel® S Typical Properties of Vespel® Parts & Shapes  (364KB)
    A collection of articles relating to the use of Vespel® polyimide — background on its development, its applications, demonstrations of its cost effectiveness, and details on some of its technical properties.

  • Vespel® S Design Handbook  (384KB)
    Contains comprehensive physical property and performance data on the SP polyimide resins from which Vespel® parts are made. Includes chemistry, fabrication, and properties data. Selection of data for this manual has been based to some extent on discussion with customers’ design engineers involved with applications of Vespel® parts.

  • Vespel® S Technical Info Guide to Machining  (385KB)
    Machining procedures including safety precautions, sawing, holding, turning, milling, drilling, etc., of Vespel® S parts and shapes.

  • Vespel® SF-0920, 0930, 0940 General Machining Guide  (190KB)
    Machining procedures including safety precautions, sawing, holding, turning, milling, drilling, etc., of Vespel® SF parts and shapes.

  • Vespel® Technical Info Shapes SP Machining Stock  (220KB)
    Includes stock shape dimensions, properties guide and typical application usage.

  • Vespel® ST Technical Information  (160KB)
    Technical information including typical properties of the superior toughness grades.

General Brochures & Design Guides

  • Vespel® Product Guide  (424KB)
    Our expanded lineup consists of five families of materials that provide a unique combination of physical properties, offering you the ultimate in design flexibility. Starting as the Vespel® S line, the family has grown to include the introduction of Vespel® TP, a new innovative thermoplastic material by DuPont; Vespel® CP(composites); Vespel® CR (chemical resistant); and Vespel® ASB(assemblies). This brochure provides a comprehensive list of grades for each of the five families.

  • DuPont™ Vespel® Semiconductor Materials Solutions – Consistent Performance for High Yields  (380KB)
    DuPont™ Vespel® polyimide parts come with a documented record of reliability and durability in wafer handling, wafer processing, IC handling and testing, and other semiconductor manufacturing operations. As an alternative to ceramics, quartz and unproven types of plastics, Vespel® parts reduce ownership costs with longer life in the chamber and extended maintenance intervals.

  • DuPont™ Vespel® polyimide parts and shapes – Proven Performers in Semiconductor Manufacture  (1.1MB)
    DuPont™ Vespel® polyimide parts come with a documented record of reliability and durability in wafer handling, wafer processing, IC handling and testing and other semiconductor manufacturing operations.

  • Vespel® Bearings Guide  (231KB)
    The design guide is provided to help you choose the Vespel® bearing that is best suited to your application. Includes general information about bearing design; a method for determining pressure-velocity (PV) loading, and a sample bearing design problem, plus more.

  • Vespel® Technical Information — Use of Adhesives  (55KB)
    Introduction to variety of adhesives and surface preparation information for Vespel® polyimide SP parts.

To get technical literature about the other Vespel® product families, click here to go to the all-inclusive literature page or click on the product family link of interest in the left-hand navigation. There also is a 'Helpful Link' to literature on the right-hand side of each product page.