Taipei, Taiwan, October 7, 2009
DuPont to Present Papers at IMPACT 2009
DuPont representatives will present two key technical papers at the 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) at Taipei Nangang Exhibition Hall, Taipei, Taiwan, October 21 - 23, 2009.
Session 19: Green PCB & PCBA II
10:00-12:10, Friday, October 23, 2009
Room 504b
10:00
AS024-1
(Invited Speech)
Image Transfer Solutions for Future Demand
Presented by Toru Takahashi and L C Chen, DuPont Japan Kabushiki Kaisha
Session 21: Green Materials & Process II,
13:30-17:40, Friday, October 23, 2009
15:40
TW034-1
Wafer Level Packaging Solutions for CMOS Image Sensors
Presented by Bin-Hong Tsai, DuPont Electronic Technologies
» View Abstract and Download Paper
