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October 7, 2009DuPont Presents Papers at IMPACT 2009 DuPont representatives will present two key technical papers at the 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference. »More

August 19, 2009 WLP Solutions Introduces PerMX™ 3000 Photodielectric Dry Film Adhesive DuPont Wafer Level Packaging (WLP) Solutions has introduced DuPont™ PerMX™ 3000 photodielectric dry film adhesive - the first in a new series of permanent photodefinable, low temperature cure epoxy materials uniquely suited for applications in 3D/TSV and wafer level packaging of electronic components and MEMS. » 中文网页

August 10, 2009 Free Download Available on Materials for Thin Wafer Processing DuPont Wafer Level Packaging (WLP) Solutions recently presented an overview of wafer level packaging materials to meet the challenges of thin wafer processing at the Thin Wafer Processing for 3D TSV Applications Workshop hosted by SUSS MicroTec, July 15th during Semicon West. »More

May 21, 2009HD MicroSystems™ Introduces HD-8930 Ultra-Low Cure PBO for Wafer Level Semiconductor Packaging The new offering is the latest in the HD-8900 low-cure PBO series and combines the proven reliability of HD MicroSystems’ PBO technology with curing temperatures as low as 200°C. With its low modulus and high elongation, HD-8930 achieves superior drop test results, making it ideal for use in portable electronic devices. »More

March 2, 2009DuPont highlights Wafer Level Packaging Solutions at IMAPS Device Packaging 2009 Conference DuPont will feature new ultra-low cure dielectric materials for WLP and 3D/TSV applications, and spotlight advanced material sets and process technologies for Fan Out, 3D/TSV, RDL, Bonding and Bumping applications. »More

January 29, 2009DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement Joint Development Agreement to develop new advanced photodefinable epoxy based materials directed to emerging WLP and 3D/Through-Silicon Via (TSV) applications. »More

September 23, 2008DuPont Electronic Technologies Expands Wafer Level Packaging Solutions DuPont Electronic Technologies has announced a new expansion focused on material solutions for wafer level packaging (WLP) and emerging three dimensional (3D) and Through Silicon Via (TSV) semiconductor packaging applications »More

July 11, 2008DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging EKC Technology will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level Packaging (WLP) for copper pillar and solder bump applications at SEMICON West. »More

May 2, 2008DuPont to Feature Wafer Level Packaging Offerings at ECTC 2008 DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference. »More

February 19, 2008DuPont To Present Technical Papers at 2008 IMAPS Device Packaging Conference DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical.   » More

October 29, 2007DuPont Participated in Advanced Packaging Technology Roadshow in Asia DuPont    Advanced Packaging Lithography was part of  "Small-Dimensions – Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration.   » More