Non-photodefineable, adhesives
Application: Permanent Adhesive
Features: Low Cure |
These polyimides are suitable for applications where the high cure temperatures typically used for polyimides (350°C) cause problems. These polyimides imidize faster and at lower temperatures (200°C) than standard polyimide precursors.
Applications are anticipated in 3D and other advanced packaging processes.
Please check for updates and further information in the weeks to come.
