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Wafer Level Packaging Solutions


Non-photodefineable, adhesives

Application: Permanent Adhesive
Features: Low Cure

These polyimides are suitable for applications where the high cure temperatures typically used for polyimides (350°C) cause problems. These polyimides imidize faster and at lower temperatures (200°C) than standard polyimide precursors.

Applications are anticipated in 3D and other advanced packaging processes.

Please check for updates and further information in the weeks to come.