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Wafer Level Packaging Solutions

EKC162™ Photoresist Remover

EKC162™ Photoresist Remover for Fanout

WLP EKC162™ is a formulation optimized to effectively remove thick and thin photo resists used for TSV masks and wafer bumping by solder electroplating or stencil printing with superior bath life and wafer capacity. The product is designed for use in spray processing equipment and wet benches and is capable of removing resist faster and at a lower temperature than the competition.

Rapid removal of MX5000 dry film<Rapid removal of MX5000 dry film  with EKC162™