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Wafer Level Packaging Solutions

EKC Series TSV Etch Residue & Photoresist Remover

TSV before MX5015 Dry Film removal and post-etch residue removal

TSV before MX5015 Dry Film removal and post-etch residue removal

EKC162™ Photoresist Remover for TSV

WLP EKC162™ is a formulation optimized to effectively remove thick and thin photo resists used for TSV masks and wafer bumping by solder electroplating or stencil printing with superior bath life and wafer capacity. The product is designed for use in spray processing equipment and wet benches and is capable of removing resist faster and at a lower temperature than the competition.

Resist Removal with EKC162™ Resist Removal with EKC162 

EKC175™ TSV Post Etch Residue Remover

EKC175™ completely and efficiently removes tough post-etch residues formed from DRIE TSV processes, enabling a defect free via filling process.

TSV Post-etch Residue Removal with EKC175™ TSV Post-etch Residue Removal with EKC265