WLP EKC162™ is a formulation optimized to effectively remove thick and thin photo resists used for TSV masks and wafer bumping by solder electroplating or stencil printing with superior bath life and wafer capacity. The product is designed for use in spray processing equipment and wet benches and is capable of removing resist faster and at a lower temperature than the competition.
Resist Removal with EKC162™
EKC175™ completely and efficiently removes tough post-etch residues formed from DRIE TSV processes, enabling a defect free via filling process.
TSV Post-etch Residue Removal with EKC175™