DuPont is connecting science and technology from across the company to design integrated wafer level packaging solutions for both current and emerging wafer level packaging requirements.
Look below for our integrated solutions for wafer level packaging:
Dry Film Photoresists
- MX 5000 Series for via creation, via fill, micro bump creation and RDL structuring
- WBR Series for bumping/pillar creation
- WLP Series dry film photoresists are high resolution, multi-purpose films
- WLP 1000 Series dry film photoresists are compatible with copper pillar plating and solder bump plating
Removers and Cleaners