DuPont is connecting science and technology from across the company to design integrated wafer level packaging solutions for both current and emerging wafer level packaging requirements.
Look below for our integrated solutions for wafer level packaging:
Polyimide/PBO Coatings
Dry Film Photoresists
- MX 5000 Series for via creation, via fill, micro bump creation and RDL structuring
- WBR Series for bumping/pillar creation
- PerMX Series permanent dry film for Bonding, Cavity Packages, Micro fluidics, Dielectric & Fan Out
Removers and Cleaners
Slurries
Substrate Systems
Optical Coatings
