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Wafer Level Packaging Solutions

WLP 1000 Series dry film photoresist

WLP 1000 dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 50, 75, and 100  micron thicknesses.

Features:

  • Negative working, aqueous, processable polymer film
  • High aspect ratio resolution
  • Suitable for in-via and mushroom electroplating bumping applications
  • Suitable for copper pillar and other lead free applications