WLP 1000 dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 50, 75, and 100 micron thicknesses.
Features:
- Negative working, aqueous, processable polymer film
- High aspect ratio resolution
- Suitable for in-via and mushroom electroplating bumping applications
- Suitable for copper pillar and other lead free applications
