WLP 1000 dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 50, 75, and 100 micron thicknesses.
Features
- High Resolution for Fine Pitch Electro Plating Process
- High Chemical Resistance for Silver Plating, ENIG and ENEPIG
- No Damage for Active Metal Even Through RIE Process
Na2CO3 and TMAH Developable
- Fast and Totally Dissolved Stripping Mode
Benefits
- Capability for finer pitch work than alternative products
- Improved plating performance
- Higher development productivity when using TMAH
- Cleaner stripping
