By: Colin Tsai
DuPont Electronic Technologies, Wafer Level Packaging Solutions
A newly developed formulation for thick photo resist removal has been jointly developed by DuPont’s EKC and WLP businesses to enable high-performance wafer bumping. This paper describes the compatibility and stripping performance achieved with an innovative photoresist removal technology on various sample wafers with liquid and dry film photo resist. The results presented will open up new opportunities for advanced bumping applications which require pitches of 100μm and below.
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