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Wafer Level Packaging Solutions

HD-8800

Photodefineable, positive, aqueous

Application: Stress Buffer, Packaging
Features: Low Modulus, High Elongation, Low Moisture Uptake

This product is the latest technology for semiconductor stress buffer and packaging applications. It is positive acting for high resolution and develops using aqueous chemistries for lower total process costs.

Cured films have good mechanical and thermal properties to hold up in the most demanding applications. Low moisture uptake and good dielectric properties protect vital circuitry.

  • HD-8820 – Cured Film, thickness 4 – 10µm
 

NOTE: These materials use TMAH as an aqueous developer. TMAH is not supplied by HD MicroSystems™.



HD-8930

Photodefineable, positive, aqueous

Application: Stress Buffer, Packaging
Features: Low Cure

This new offering is the latest in the HD‑8900 low-cure series and combines the proven reliability of PBO technology with curing temperatures as low as 200°C.  The new polymer backbone provides superior chemical resistance, thermal and mechanical properties.  HD‑8930 is available for sampling late third quarter this year. 

HD-8930, Cured Film Thickness 5 – 10µm

For further information, contact us or your local HD MicroSystems Technical Representative