DuPont offers inegrated wafer level packaging materials enabling Redistribution Dielectrics. For more detailed information on these products follow the links provided below.
Photodefineable materials can be patterned directly by exposure to UV light. They can either harden with exposure (negative acting) or soften with exposure (positive acting).
HD-4100 Series products are becoming the industry standard for packaging and redistribution layers.
HD-8800 Series and 8900 Series products are the latest technology for semiconductor stress buffer and packaging applications.
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