Through Silicon Via (TSV) / 3D Packaging : DuPont Wafer Level Packaging Solutions

DuPont Home Global [change]

Our Company Science Sustainability Investor Center Media Center Career Center

DuPont Home

Wafer Level Packaging Solutions

Uses & Applications

Through Silicon Via (TSV) / 3D Packaging

Wafer Level Packaging Home

Products

Uses & Applications

Through Silicon Via (TSV) / 3D Packaging Dry Film Photoresists TSV Photoresist Removers and Via Cleaners Photosensitive Polyimide Coatings Thermally Conductive / Thermally Resistant Substrates CF Deposition Cleaning Agents Dry Etching Gases Pillars & Bumping Bonding Redistribution Dielectrics Fan Out

Sales & Support

Technical Info

Printer Friendly Version

DuPont Products & Services

DuPont Brands & Trademarks

Through Silicon Via (TSV) / 3D Packaging DuPont offers integrated wafer level packaging materials enabling Through Silicon Via (TSV) and 3D Packaging. For more detailed information on these products follow the links provided below. Dry Film Photoresists Designed for TSV, RDL, lift off and other MEMS applications. These films are available in a range of 15-20 micron thicknesses. » More TSV Photoresist Removers and Via Cleaners Designed to rapidly remove photoresist and TSV etch residue without significant metal or TSV side wall attack. » More Photosensitive Polyimide Coatings Industry standard polyimide and PBO coatings or RDL » More Thermally Conductive/Thermally Resistant Substrates Thermal substrates for submount, chip-on-board and metal core PCB LED packaging applications. » More CF Deposition Cleaning Agents Designed to effectively clean CF deposition on TSV side wall » More Dry Etching Gases High quality C4F8 for TSV side wall passivation » More		Helpful Links WLP Materials Overview for 3D/TSV [.pdf]
FAQ \| Site Map \| Legal Notices & Terms of Use \| PRIVACY . Copyright © 2012 DuPont or its affiliates. All rights reserved. The DuPont Oval Logo, DuPont™, The miracles of science™ and all products denoted with ® or ™ are registered trademarks or trademarks of E. I. du Pont de Nemours and Company or its affiliates.

Through Silicon Via (TSV) / 3D Packaging

Helpful Links