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Wafer Level Packaging Solutions

Through Silicon Via (TSV) / 3D Packaging

DuPont offers integrated wafer level packaging materials enabling Through Silicon Via (TSV) and 3D Packaging. For more detailed information on these products follow the links provided below.

Dry Film Photoresists

Designed for TSV, RDL, lift off and other MEMS applications. These films are available in a range of 15-20 micron thicknesses.

 

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TSV Photoresist Removers and Via Cleaners

Designed to rapidly remove photoresist and TSV etch residue without significant metal or TSV side wall attack.

 

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Photosensitive Polyimide Coatings
Photosensitive Polyimide Coatings

Industry standard polyimide and PBO coatings or RDL

 

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Thermally Conductive/Thermally Resistant Substrates
Thermally Conductive/Thermally Resistant Substrates

Thermal substrates for submount, chip-on-board and metal core PCB LED packaging applications.

 

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CF Deposition Cleaning Agents
CF Deposition Cleaning Agents

Designed to effectively clean CF deposition on TSV side wall

 

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Dry Etching Gases
Dry Etching Gases

High quality C4F8 for TSV side wall passivation

 

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