DuPont offers inegrated wafer level packaging materials enabling Fan Out. For more detailed information on these products follow the links provided below.
HD-8800 Series products are the latest technology for semiconductor stress buffer and packaging applications.
Down to 10 microns, DuPont MX Series thin film photoresists for electroplating, and wet and dry etching or redistribution conductors and UMB's
Designed to rapidly remove MX5000 series dry film without significant metal attack.
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