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Wafer Level Packaging Solutions

Uses & Applications

DuPont is connecting science and technology from across the company to design integrated wafer level packaging solutions for both current and emerging wafer level packaging requirements.

Look below for integrated solutions for:

Through Silicon Via (TSV)/3D Packaging

Integrated Material Sets Enabling  3D/TSV

 

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Pillars/Bumping

Integrated Materials System for Bumping

 

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Bonding

Advanced Adhesives for Bonding


 

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Redistribution Dielectrics (RDL)

The Indusrty Standard for RDL & WL-CSP

 

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Fan Out

Advanced Materials Enabling Fan Out

 

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