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Wafer Level Packaging Solutions

Pillars & Bumping

DuPont offers inegrated wafer level packaging materials enabling Pillars and Bumping. For more detailed information on these products follow the links provided below.

Thin Dry Film Photoresists

Down to 10 microns, DuPont MX Series thin film photoresists for electroplating, and wet and dry etching of redistribution conductors and UBM’s

 

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Thick Dry Film Photoresists

DuPont WB Series provides consistent, precise patterning using a wide range of metals to form bumps and pillars up to a height of 120 microns

 

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Dry Film Removers

EKC's removers and cleaners designed for electroplated and printed solder, Cu and Au bumps provide consistently clean resist removal with faster stripping times, at lower temperatures and the ability to rework wafers, without significant metal attack.

 

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