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Wafer Level Packaging Solutions

Wafer Level Packaging Photoresist Removers

EKC162™ WLP photo resist remover and the new WBR 2000 dry film resist were co-developed to work with the HD MicroSystems PI and PBO redistribution dielectrics to take the burden of lengthy qualification / integration of products off the customers' shoulders.

  • Water rinseable semi-aqueous remover
  • Co designed with DuPont WB Series Dry Film to strip in half the time of competitive strippers
  • Fully Compatible with HD Microsystems PI & PBO redistribution dielectrics
  • Strips at process temperature much lower than competition
  • Capable of removing + 100 micron thick film
  • Extended bathlife
  • Easy rework of partially stripped resist
  • Wet bench and spray tool compatible
  • Pb/Sn, Sn/Ag, Cu, Ni, TiW compatible
  • POR for production of high end logic devices
  • Ability to rework uncured HD MicroSystems PI & PBO material 

DuPont WBR Series Dry Film

Cu bump

PbSn Bump

Ni Bump

Au Bump Pad



Liquid Resist

PbSn Over plated Bump